Semiconductor Technology at TSMC, 2011

3-Second Blueprint (English)

1. Polycrystalline silicon is melted, doped with arsenic, phosphorus, or boron, and pulled into monocrystalline ingots sliced into wafers.
2. Photolithography exposes circuit patterns onto photoresist-coated thin films before selective etching and sputtered metal interconnects.
3. Scaling to 300 mm (12-inch) wafers increases die yield per wafer and relies on automated material handling systems inside cleanrooms.